wavesolder(faraway) R Documentation Defects in a wave soldering process Description Components are attached to an electronic circuit card assembly by a wave-soldering process. The soldering process involves baking and preheating the circuit card and then passing it through a solder wave by conveyor. Defect arise during the process. Design is $2^{7-3}$ with 3 replicates. Usage data(wavesolder) Format A data frame with 16 observations on the following 10 variables. y1 Number of defects in the first replicate y2 Number of defects in the second replicate y3 Number of defects in the third replicate prebake prebake condition - a factor with levels 1 2 flux flux density - a factor with levels 1 2 speed conveyor speed - a factor with levels 1 2 preheat preheat condition - a factor with levels 1 2 cooling cooling time - a factor with levels 1 2 agitator ultrasonic solder agitator - a factor with levels 1 2 temp solder temperature - facctor with levels 1 2 > wavesolder y1 y2 y3 prebake flux speed preheat cooling agitator temp 1 13 30 26 1 1 1 1 1 1 1 2 4 16 11 1 1 1 2 2 2 2 3 20 15 20 1 1 2 1 1 2 2 4 42 43 46 1 1 2 2 2 1 1 5 14 15 17 1 2 1 1 2 1 2 6 10 17 16 1 2 1 2 1 2 1 7 36 29 53 1 2 2 1 2 2 1 8 5 9 16 1 2 2 2 1 1 2 9 29 0 14 2 1 1 1 2 2 1 10 10 26 9 2 1 1 2 1 1 2 11 28 173 19 2 1 2 1 2 1 2 12 100 129 151 2 1 2 2 1 2 1 13 11 15 11 2 2 1 1 1 2 2 14 17 2 17 2 2 1 2 2 1 1 15 53 70 89 2 2 2 1 1 1 1 16 23 22 7 2 2 2 2 2 2 2